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Bonding Head: | Pulse Soldering | Working Pressure: | 45-75psi |
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Suitable Size: | 20-100 Inch | Application: | TV Repair TAB Bonding |
Pressure: | 0.4pa | Weight: | 550kg |
COF Bonding Macine LCD TV Panel Repair Machine With Two Titanium Alloy Head
Pulse Bonding LCD TV Panel TAB Bonding Machine Profile:
Many customers receive different tv brand LCD Panel to repair in their workshop,but not all the panel problem can be solve out,like the broken crack panel,unless this problem,others problem is no problem for our machine to repair them.
Our LCD TV Panel Repair Machine is used for various FPC, FOG, COF, TAB, COG and LCD/LED Panel and PCB conbination bonding, reflected in various size LCD screen vertical line, horizontal line, vertical band, black band, black line, color line, color band, multi-line, lurred screen, black screen, white screen, interference flashing, vertical semi-significant etc. malfunction maintenance.
LCD TV Screen Repair TAB Bonding Machine Equipped Accessories:
D. Equipped with High precision alignment system make the alignment and bonding process more precision and correct.
Advanced optical alignment system, fully meet the product clear alignment and production precision, para X, Y, Z axis adopts high precision micrometer regulator, rail synchronous operation, ensure high precision alignment. 19 inch large screen display contrapuntal line electrode, the alignment more quickly, more elegant appearance
Product Name: |
65 Inch TV LCD Repair Single station Pulse Heating COF/FOG Bonding machine |
Suitable For: | Suitable for FPC/COF Contraposition bonded to LCD which attached ACF,Used for COF repair |
Size Range: | 13-65inch |
Bonding Precision: | X±0.01MM ,Y±0.01MM |
Machine Capacity: | 12S/Pcs,2500pcs/day |
Indenter Qty: | 1PCS |
Power Supply: | 220V±10%,50HZ,1500W |
Air Supply: | 0.4~0.7MPa,dry air |
FPC size: | Max:L80*W60MM Min:L10*W15MM |
Platform Precision: | ±0.01MM |
Pressure Head Size: | 80*1MM (customizable) |
Temp Range: | RT~400 |
Time Range: | 1~99.9sec |
Product Size: | W1200*850*H1300MM |
N.W: | About 200kg |
What is the COF
1, The popular explanation:
COF package is to put the IC dependend on FPC: COF package for flip chip film.
2, Professional explanation:
COF is the abbreviation of Chip - on - flex, is to put the IC dependend on FPC,a new technology developed of liquid crystal display module, by it in terms of product size, weight, high integration, have very big breakthrough.Due to the flexible circuit board PCB thickness thin, lighter than the solid, so COF package module is small volume, light weight, and the design and production speed is quickly.
What is the pulse hot-pressing machine?
1, The popular explanation:
Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.
2, Professional explanation:
Pulse hot press is the English translation of Pulse hot press, by hot pressing head loading Pulse voltage, ?hot head heating , will be connected to this object to heat up, when the temperature rises to soldering tin melting point (i.e., to simulate the temperature after), will be connected to the tin melting between the objects and connect it together. The general Pulse hot-press temperature closed loop control.