ASCEN technology co.,ltd

Stable Hot Bar Soldering Machine With Japan Bonding Head COF TAB Bonding Machine

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Description
Material: Titanium Bonding Bonder: Pulse Heat Bonding
Hot Bar: Bonding Lead Time: 5 Days
Head Size: Customized Soldering: Stable Temperature

 

 

Stable Hot Bar Soldering Machine With Japan Bonding Head , COF TAB Bonding Machine

 

Hot Bar Soldering Machine With Japan Bonding Head TAB COF Bonding

 

Parameter Input and Adjustment Mode Stage X adjustment Touch panel setting
Bonding height Micrometer Adjustment
Bonding Adjustment Imported fine thread screw
FOG adjustment X Y Q micrometer adjustment
CCD lens adjustment XYZ axis manual adjustment
Product Positioning Vacuum absorption
Parameter Input CN/EN interface
Program Storage 20sets
Facility Requirement Power Supply AC220V 50Hz±10%
Max Currency 15A 3000W
Supply Power 0.6~1Mpa(Dry Air)
Pipe 8MM
Ambient Any clean room(ACF bonding need to be in clean room)
Machine Type Vertical
Height 750MM
Dimension Approx. 2600mm(L)×1500mm(W)×1800mm(H)
Weight Approx. 600kg
Safety Protection Program Security Password permission
Alarm Function Self-detect alarm and prompt function
Bond Head Protection Abnormal temperature alarm.
Work Safety Protection Double start-up buttons and emergency stop button.
Work Protection Software act interlocking
Accessories Bond Head 1pc(customization)
Quarz bar 1pcs(customization)
Manual 1pc

 

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