ASCEN technology co.,ltd

Pulse Heat Hot Bar Soldering Bonding Machine For Iphone LCD Screen Repair

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Description
Head: 80mm(can Customized) Heating System: Pulse Heating
Work Cycle: 13s(adjustable) Bond: Pulse Heat
Control: Panasonic PLC Control Work Pressure: 0.27 - 0.5MPa

 

 

 

Pulse Heat Hot Bar Soldering Bonding Machine For Iphone LCD Screen Repair

 

Features:

 

  Pulse and Constant heating available, high speed temperature rise/drop and auxiliary cooling system. Can store up to 15 programmable profiles, 6 steps of setting available.

 

  High magnification coaxial optical alignment system ensures the accuracy of product alignment.

 

  Adopts imported temperature control system, fast heating. Accurate temperature control. Temperature rising curve and parameter display synchronously.

 

  High quality titanium alloy bond head , automatic temperature compensation feature increase accuracy of temperature.

 

  High accuracy imported screw adopted in the platform x axis, slider positioning synchronously. PLC set and save the IC position automatically according to the production requirement.

 

  Full color ergonomic touch panel interface helps operation more convenient and visual.

 

  Suitable for all kinds of bonding between TAB, FPC and PCB in 12-24 inches TFT.

 

 

 

Specification:

 

Control System LG-K7M-DR-PLC
Operating Interface WEIVEW Full-Color PDA
Pressure Range 1-28.2kgf
Time Range 1-100s
Throughput 180-240PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Range RT-500 Degree Celsius
Product Min Pitch pitch≥ 0.01mm
Product Max Size 21 inches
Alignment Min Width 10um
CCD Magnification 120-240 X
Temperature steps 6(including start / away temperature)
Temperature rise time/step 1-2 s/step
Power 0.75KW
Thermocouple K Type
Weight 190KG
Dimension (L) 1060mm × (W) 985mm × (H) 1608mm

 

 

 

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