| ASCEN technology co.,ltd |
1200W LCD TV Panel Repair Machine For SAMSUNG LG Panasonic LCD Screen Bonding
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| Pulse Heat: | TAB Bonding Machine | Bonder: | Pulse Heat Bonding |
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| TV: | LCD Repair Machine | Lead Time: | 5 Days |
| Temperature: | 0-399 | Type: | Laser Tv Repair |
LCD TV Bonding Machine For SAMSUNG LG Panasonic LCD Screen Bonding
TAB Bonding Machine Details
| ACF BONDING MACHINE SPECIFICATIONS | |
| Device Description | Repair screen machine / Bonding machine |
| Device Uses | FPC, COF,TAB, LCD Panel and PCB combination bonding |
| Applicable LCD panel specifications | 12"-85" |
| Applicable LCD panel thickness | 0.3MM-1.1MM[Single glass] |
| Bonding IC number | Multiple / Panel |
| Bind direction | X or Y Uni-direction |
| Supply Pressure | 0.5~0.7Mpa (Dry air source) |
| Power Supply | AC 220V±10%,50HZ,1200W |
| Cylinder Device | SMC original thin cylinder |
| Pressure System | Pressure system parallel bars structure can eliminates Indenter own weight, the pressure minimum accuracy to 0.1 KG , pressure part both are use SMC precision components |
| Heating Type | Pulse (rapid heating / cooling and auxiliary cooling function) |
| PID Temperature Control System |
Branded:Adjustable heating curve Precision PID self-tuning type The peak temperature : within +/- 2 degrees Celsius Room temperature time to 180 degrees the response time within 2-3 seconds |
| Hot pressing head |
Materials: Titanium origin: United States 45*1.4*10 Plane precision (hot press side) :0.001mm Plane thickness 0.5 (Reserved 3 times grinding) |
| Thermocouple Type | K type OMEGA wire |
What is the COF
1, The popular explanation:
COF package is to put the IC dependend on FPC: COF package for flip chip film.
2, Professional explanation:
COF is the abbreviation of Chip - on - flex, is to put the IC dependend on FPC,a new technology developed of liquid crystal display module, by it in terms of product size, weight, high integration, have very big breakthrough.Due to the flexible circuit board PCB thickness thin, lighter than the solid, so COF package module is small volume, light weight, and the design and production speed is quickly.
What is the pulse hot-pressing machine?
1, The popular explanation:
Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.
2, Professional explanation:
Pulse hot press is the English translation of Pulse hot press, by hot pressing head loading Pulse voltage, ?hot head heating , will be connected to this object to heat up, when the temperature rises to soldering tin melting point (i.e., to simulate the temperature after), will be connected to the tin melting between the objects and connect it together. The general Pulse hot-press temperature closed loop control.
