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The surprised SMT solution
ASCEN provide OEM serve and producting standard /customized automatic assembly equipment,specialize in PCB conveyor,PCB depaneling machine,PCB router,SMT component feeder,PCB loader unloader and so on
 

FFC FPC Pulse Heat Reflow TAB Bonding Machine With Titanium Bonding Head

Detailed Product Description

ASCEN technology team is escorted by a vigorous team of humble and patient staff. They enjoy listening to the clients and tailoring automatic assembly solutions up to clients' demand. we dedicated to making quality machine that help our clients operate more efficiently and effectively.If you interested in our complete equipment solution,please go to our engineering web: www.ascen.ltd




Weight: 35KG Temperature Precision: ±2°C
Max Welding: 0.25mm Size: 430*185*220
Temperature: Lcd Control After-sales Service: Engineers Available

    FFC FPC Pulse Heat Reflow Bonding Machine With Titanium Bonding Head

 

ACF Soldering Feature

 

Digital Temperature Control
High speed and highly accurate temperature control is realized by the digital PID control method, making the unit suitable for fine wires and micro-miniature works
2,Wide Variety of Temperature Monitoring Functions(0-600 degree centigrade)
3,Three Stage Heating
Various temperature profiles are realized to cope with the diversified applications
4,Good User Interface make it easy for the first users.
5,High Precision temperature Control system,with 4kHz inverter frequency,the unit feedback and accurate the temperature 0.25ms once,usually +-3 degree centigrade.

 

1,Principles of pulse heat unit:

Pulse heat unit is intended to solder electric components.
It consists of a reflow head which holds down the object and applies pressure force and the pulse heat power supply which applies the current.

Pulse heating is an instantaneous heating method. Heating is performed only when the solder is desired to be melted.
Electric current is applied to the iron to generate heat by resistance and the solder is melted. When the solder has melted, the current will be stopped and the solder is cooled. And when the solder has hardened, the heater tip is raised.

Because the pressure is kept applied until the solder is hardened, highly reliable joining without lifting up can be achieved.

 

2,Advantages of inverter pulse heat supply
PS: We have the independent property rights of the power supply, we can make customized power supply.

As the input voltage,we can also provide 220V/380V*3/220V*3/110V.etc.

  1. IGBT inverter with 4kHz frequency.
  2. Temperature closed loop control, feed back every 0.25ms.
  3. Real time display temperature curve.
  4. Upper and lower monitor of the temperature.
  5. Easily operating.
  6. Overheat protection, overvoltage/undervoltage protection.
  7. High precisely heating control system.
  8. Two steps heating with upslope.
  9. Ease for automation.
  10. Standard workpiece holder is mounted on the board and designed to allow for easy changeover and repeatable operation
  11. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined
  12. Optional CCD system for fine pitch component.

 

3,Technical parameters

Model/No JYR-02L JYR-03L JYR-04L
Iput Voltage(V) 220 220 3*380
Duty cycle(%) 20 20 20
Rated power(kVA) 6 10 12
Heating Tem() 50-600 50-600 50-600
Weight(kG) 23 24

 

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ASCEN technology co.,ltd specializing in the SMT automatic equipment and provide the automatic solution for the smart factory for save more producing cost.

Contact Details

Whether you'd like to get more info on what,why and how we do what we do, need help with what you're creating,would line to partner up or just say hi!

—--- We'd love to hear from you.

Tel/Whatsapp:13377777085

Email:info@ascen.ltd

Skype:supplier889

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