Material: | Titanium Bonding | Bonder: | Pulse Heat Bonding |
---|---|---|---|
Hot Bar: | Bonding | Lead Time: | 5 Days |
Head Size: | Customized | Soldering: | Stable Temperature |
Stable Hot Bar Soldering Machine With Japan Bonding Head , COF TAB Bonding Machine
Hot Bar Soldering Machine With Japan Bonding Head TAB COF Bonding
Parameter Input and Adjustment Mode | Stage X adjustment | Touch panel setting |
Bonding height | Micrometer Adjustment | |
Bonding Adjustment | Imported fine thread screw | |
FOG adjustment | X Y Q micrometer adjustment | |
CCD lens adjustment | XYZ axis manual adjustment | |
Product Positioning | Vacuum absorption | |
Parameter Input | CN/EN interface | |
Program Storage | 20sets | |
Facility Requirement | Power Supply | AC220V 50Hz±10% |
Max Currency | 15A 3000W | |
Supply Power | 0.6~1Mpa(Dry Air) | |
Pipe | 8MM | |
Ambient | Any clean room(ACF bonding need to be in clean room) | |
Machine Type | Vertical | |
Height | 750MM | |
Dimension | Approx. 2600mm(L)×1500mm(W)×1800mm(H) | |
Weight | Approx. 600kg | |
Safety Protection | Program Security | Password permission |
Alarm Function | Self-detect alarm and prompt function | |
Bond Head Protection | Abnormal temperature alarm. | |
Work Safety Protection | Double start-up buttons and emergency stop button. | |
Work Protection | Software act interlocking | |
Accessories | Bond Head | 1pc(customization) |
Quarz bar | 1pcs(customization) | |
Manual | 1pc |
ASCEN technology co.,ltd specializing in the SMT automatic equipment and provide the automatic solution for the smart factory for save more producing cost.
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