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Multi panel PCB depaneling amchine

Laptop LCD TV Panel Repair Machine Samsung LG COF Repair Machine

: Large Image : Laptop LCD TV Panel Repair Machine Samsung LG COF Repair Machine

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Detailed Product Description

ASCEN technology team is escorted by a vigorous team of humble and patient staff. They enjoy listening to the clients and tailoring automatic assembly solutions up to clients' demand. we dedicated to making quality machine that help our clients operate more efficiently and effectively.If you interested in our complete equipment solution,please go to our engineering web: www.ascen.ltd

TV:	Bonding Machine	Bonder:	Pulse Heat Bonding
Monitor:	5.7 "color Touch Screen	Brand:	Samsung LG
Warranty:	One Year	Programing:	YES

Laptop LCD TV Screen Bonding Machine For Samsung LG COF Repair Machine

1, The popular explanation:

COF package is to put the IC dependend on FPC: COF package for flip chip film.

2, Professional explanation:

COF is the abbreviation of Chip - on - flex, is to put the IC dependend on FPC,a new technology developed of liquid crystal display module, by it in terms of product size, weight, high integration, have very big breakthrough.Due to the flexible circuit board PCB thickness thin, lighter than the solid, so COF package module is small volume, light weight, and the design and production speed is quickly.

What is the pulse hot-pressing machine?
1, The popular explanation:

Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.

Vacuum Range	-13~-85Kpa
Air Consumption	150L/min
Bond Head Flatness	±4um( testing by FUJIFILM Prescale)
Alignment Accuracy	±10um
Product Min Pitch	Pitch≥20 um
Product Size	Max 26"
Alignment Min Width	10mm

ASCEN technology co.,ltd specializing in the SMT automatic equipment and provide the automatic solution for the smart factory for save more producing cost.

Contact Details

Whether you'd like to get more info on what,why and how we do what we do, need help with what you're creating,would line to partner up or just say hi!

—--- We'd love to hear from you.

Tel/Whatsapp:13377777085

Email:info@ascen.ltd

Skype:supplier889