LCD Hot Bar Soldering Machine / Pulse Heat Hot Bar Bonding Equiqment

    LCD Hot Bar Soldering Machine/Pulse Heat Hot Bar Bonding Equiqment  

Features for Soldering Machine:

1. Closed Loop PID temperature control with visible LED display
2. LCD display programmable pressure switch for precise force control
3. Each heating cycle is triggered by a real time pressure sensor
4. Floating thermode ensures consistent pressure and heat transfer
between the thermode head and the parts to be joined
5. Silicon rubber can be fitted in bonding Heat Seal Connectors
between LCD and PCB
6. Standard workpiece holder is mounted on a linear guideway and
designed to allow for easy changeover and repeatable operation
7. Parts registration is adjusted by micrometer and secured by vacuum
lock
8. Optional CCD system for fine pitch component

Description:

Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call hot bar reflow soldering system. This technology, also known as pulse bonding, differs from traditional soldering since the reflow process uses thermode technology, which is based on rapid reflow by pulse heating. This procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damage to the flex. It selectively solders parts by heating them to a temperature that's high enough to cause their adhesive or solder to melt and then re-solidify to form a permanent bond.

Specifications for Soldering Machine:

Data lines Link welding machine
1. Accurate Tin press,not drag
2. Accurate heat
3. Fine-pitch positioning
4. Precision